Silicon dioxide, also known as silica, is an oxide of silicon with the chemical formula SiO2, most commonly found in nature as quartz and in various living organisms. In many parts of the world, Silicon Dioxide (Fused Quartz)(SiO2) Sputtering Targets (Size:1’’ ,Thickness:0.125’’ , Purity: 99.995%) is the major constituent of sand. Notable examples of silicon dioxide include fused quartz, fumed silica, silica gel, and aerogels. Silicon dioxide is used in structural materials, microelectronics (as an electrical insulator), and as components in the food and pharmaceutical industries.
Silicon dioxide is a widely used thin film material. Silicon dioxide (Fused Quartz) sputtering targets has many excellent properties such as anti-resistance, hardness, corrosion resistance, dielectric, optical transparency etc. There are many fields that silicon dioxide is used. In microelectronic field, silicon dioxide is widely used as the most common dielectric. As silicon dioxide (Fused Quartz) sputtering targets has adjustable forbidden band width, it can be served as light absorption layer of the thin film of amorphous silicon solar cells to improve light absorption efficiency. Silicon dioxide also can be used as the gate dielectric layer of MOS and CMOS devices or the thin film transistor. In optical field, silicon dioxide is utilized for passive or active optical devices, which not only have excellent light-admitting quality but also have other basic functions, such as electro-optic modulation and optical amplification. Therefore, silicon dioxide can be used as waveguide film, AR coating and antireflection film. In the packaging industry, silicon dioxide film is used as a barrier layer of polymer packaging materials. Most of modern packaging materials cannot offer a sufficient barrier against permeation of gases, which will lead to a reduced self-life of food and drink. Just because of this, a silicon dioxide film deposited on the surface of polymer packaging becomes popular and indispensable. Besides, silicon dioxide film also can be used as a corrosion protective layer of metals. Because of the universal application of silicon oxide films in various fields, preparation of silica with high quality is always an important content of scientific research. Preparation methods of silica change with its different purposes and requirements .At present, there are a lot of preparation methods of silica, mainly including physical vapor deposition (PVD), chemical vapor deposition (CVD), sol-gel method, oxidation method etc. Among them, physical vapor deposition (PVD) includes evaporating deposition, sputtering deposition and ion plating; chemical vapor deposition (CVD) mainly includes traditional chemical vapor deposition and plasma enhanced chemical vapor deposition (PECVD). In addition, atmospheric pressure plasma deposition technology is also a common coating technology, because it does not need to vacuum, suitable for mass deposition.